5G ELECTRONIC INNOVATION R&D AND TESTING SEMINAR

2020.8.26-8.27 

Shenzhen Convention and Exhibition Center Exhibition(Futian District, Shenzhen)

BACKGROUND

Amid the recent flurry of new infrastructure policies, since 2020 5G network construction has been accelerated and a whole host of new 5G mobile phones have been launched. According to data released by the China Academy of Information and Communications Technology, mainland China reported total shipments of 21.756 million mobile phone units in March, up 240.79 percent month on month. This number includes 6.215 million units of 24 newly launched 5G phones, which were up 161.3 percent month on month, showing huge market potential.

Meanwhile, the total 5G investment budget of China's three major telecom operators this year has soared to over 180 billion yuan, up more than 300 percent year on year. Besides, the expected construction volume of 5G base stations has kept rising, to 700,000-800,000. The three operators' orders are worth hundreds of billion yuan, which will further expedite the popularization of 5G phones and spark a wave of users upgrading their handsets to 5G models. This will also pose a new challenge for the innovative design, R&D, and testing of 5G electronic terminals (mainly 5G mobile applications and 5G Mifi applications) and 5G communication base stations (mainly antenna modules) application products.

To promote the innovative development of the 5G electronics industry, 5G ELECTRONIC  INNOVATION R&D AND TESTING SEMINAR will take place at the Shenzhen Convention & Exhibition Center from August 26 to 27 during ELECTROTEST CHINA 2020. The two-day forum will focus on hot topics within 5G, including the design, R&D, and testing of electronic terminal products, as well as the environmental applications of 5G mini base stations.

Visitors

Electronics Manufacturers Enterprise

HUAWEI, OPPO, MI, VIVO, APPLE, SAMSUNG, ZTE, TCL, LG, HISENSE, MEIZU, LENOVO,NUBIA,SKYWORTH,CHINA MOBILE, CHINA UNICOM, CHINA TELECOM,MTC,BYD,SHENZHENTIANLONG,CCSAID,SHENZHENQIANHAI, T&W,SHENZHENPUYANG,TP-LINK,SDG,NATIONZ、HUAXUNCHINA,CEC,UNIONMAN,ONETHINGTECH, E-ICCO ,SZOSTONE,SHENZHENHENWEILI、SHENZHENWEILAIXINMEITI, AIRSATDDT, KBOXSZ, EAGLE-KINGDOM, SHENZHENHUIXING、 GOTECHCN, SUPERELECTRON, JUNO ETC.

Small Cell 

COMBA ,BOOMSENSE,SUNNADA,STS ,SUNSEAGROUP,BAICELLS,COMMSCOPE ,ERICSSON,FUJITSU,HUAWEI,NEC ,NOKIA,ZTE,DATANGMOBILE,INTEL,H3C,CERTUSNET,RAISECOM,RUIJIE,SUNWAVE,T&W ETC.

Labs

7LAYERS GMBH, BTL INC, MORLAB, SHANGHAI ANYWHERE TESTING CO LTD, SHENZHEN BALUN TECHNOLOGY CO. LTD, TA TECHNOLOGY (SHANGHAI) CO.,LTD, SGS WIRELESS, AUDIX, HUATONGWEI , HUAXIA, NTEK, SEM, STS, TOBY, TCT, TUV, BALUN , CTL , HUAK ETC.

Component(antenna /RF etc.)

SPEED-HZ, LAI-TIAN , SZ-SUNWAY ,TONGYU, COMMSCOPE , RFS, COMBA , SHENGLU, ELECFANS, QORVO, SKYWORKS, BROADCOM, FINGU, EASTMONEY, TONGYU , XDC-INDUSTRIES , WINGTEC, FIBOCOM, SUNSEAGROUP, HUAWEI, GOSUNCN ETC.